MAGAZINE
April/May
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Dry Claw Vacuum Pumps from Atlas Copco Boast Long Operating Time
Clean technologies are of particular importance in vacuum technology – because they are economically advantageous and environmentally friendly. With this in mind, Atlas Copco has developed the DZS 600 VSD+ and DZS 1200 VSD+.
Polar Light Technologies Demonstrates First Pyramidal‑µLED Micro‑Display Prototype
Polar Light Technologies AB today announced the successful fabrication of its first micro‑display prototype built on the company’s proprietary pyramidal micro‑LED (µLED).
memsstar to Support Walther-Meißner-Institut in Developing Next-Generation Quantum Devices
memsstar Ltd., a provider of etch and deposition equipment to researchers and manufacturers of semiconductors and micro-electrical mechanical systems (MEMS), today announced it has shipped its ORBIS Alpha XERIC oxide etch system for MEMS research and manufacturing to Germany’s Walther-Meißner-Institut for Low-Temperature Research (WMI).
Samsung Announces Ultra-Wideband Chipset with Centimeter-Level Accuracy for Mobile and Automotive Devices
Samsung Electronics Co., Ltd. today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information.
New MPLAB SiC Power Simulator Allows Customers to Test Microchip’s SiC Power Solutions in Design Phase
The electrification of everything is driving the growth of SiC semiconductors as large market segments such as E-Mobility, sustainability and industrial turn to SiC power solutions because of its fast-switching capabilities, lower power loss and higher temperature performance.
Researchers Create Breakthrough Spintronics Manufacturing Process That Could Revolutionize the Electronics Industry
University of Minnesota-led discovery has potential to make devices with ‘unmatched’ energy efficiency and memory storage density.
Semtech Enters into Cooperation Agreement with Lion Point Capital, LP
Semtech Corporation, a high-performance semiconductor, IoT systems and Cloud connectivity service provider, today announced that it has entered into a Cooperation Agreement with Lion Point Capital, LP,
Omni Design Opens Design Center in Hyderabad, India
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP) products, today announced the opening of a new design center in Hyderabad, India.
DNP Develops TGV Glass Core Substrate for Semiconductor Packages
Dai Nippon Printing Co., Ltd. has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages.
SEMICON West 2023 to Highlight Supply Chain Management, Sustainability and Workforce Development in Drive to $1 Trillion and Net Zero
Focusing on Building a Path Forward for the global semiconductor industry’s drive to $1 trillion and net zero, SEMICON West 2023 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
SIA Commends Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in Congress of bipartisan legislation to restore full tax deductibility of R&D investments.
New NASA-Funded Research Will Build Next-Gen Tech to Better Measure Climate
As part of a newly funded NASA Quantum Pathways Institute consisting of a multi-university research team, UC Santa Barbara professor of electrical and computer engineering Daniel Blumenthal will help to build technology and tools to improve measurement of important climate factors by observing atoms in outer space.
World’s Biggest Chip Design Technology Users Event Reopens Live in Silicon Valley
Synopsys, Inc. today announced the official countdown to the chip design sector’s largest EDA user conference and the company’s biggest global event of the year.
Displays With More Brilliant Colors Through a Fundamental Physical Concept
A research team from the University of Cologne (Germany) and the University of St Andrews (Scotland) has shown in a new study how a fundamental physical concept can be used to boost the color brilliance of smartphone, computer or TV screens without cutbacks in energy efficiency.
Eyeris and indie Semiconductor Collaborate
Eyeris Technologies, Inc. announced today its collaboration with indie Semiconductor, an Autotech solutions innovator, on the integration of Eyeris’ advanced monocular 3D sensing AI software with indie’s intelligent vision processor system-on-chip (SoC) using 2D image sensors.
Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems
Amtech Systems, Inc. announced today a multi-unit order for high volume reflow systems used in advanced packaging applications.
TANAKA Establishes New Overseas Subsidiary in Seoul, Korea
Establishing overseas subsidiary in Korea will invigorate transactions and expand business in the markets for fuel cell catalysts, power semiconductor materials, precursors, and precious metal recycling.
Navitas New Distribution Deal with Richardson Electronics Expands Americas Footprint for Next-Gen SiC Semiconductors
Partnership for advanced GeneSiC silicon carbide (SiC) targets renewable energy, industrial, medical, transportation, and energy storage.
Lattice Semiconductor Appoints Elizabeth Schwarting to Board of Directors
Lattice Semiconductor today announced the appointment of Elizabeth Schwarting to the Company’s Board of Directors and Nominating and Governance Committee effective March 14, 2023.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Boston Semi Equipment Announces Record Orders
Boston Semi Equipment today announced its test handler backlog has reached a historical level and continues to grow.
Pusan National University Researchers Develop Novel Stackable Hole Injection Layer Material for Solution-processed OLEDs
Researchers have now developed a novel thermally cross-linkable poly(iminoarylene), a solvent-resistant hole injection layer material with excellent film-forming properties, optimum energy level and high mobility, a major stepping stone toward commercial viability of solution-processed OLEDs.
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
Featured Video
At SEMICON West 2024, Advanced Energy further expanded on the theme of ‘Advancing the Angstrom Era’ by demonstrating its latest plasma power, high-voltage and critical temperature measurement and control technologies. Editor-in-Chief Pete Singer talked to Dhaval Dhayatkar, a Senior Director of Marketing of Plasma Power at Advanced Energy, about the company’s latest products, including new, modular platforms that meet demands for high power, high efficiency and power density AC-DC solutions across semiconductor processing and test equipment.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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