MAGAZINE
April/May
Entegris Announces CEO Succession Plan
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced that Bertrand Loy will retire as President and Chief Executive Officer after 13 years in those roles, effective August 18, 2025.
Aledia to Showcase FlexiNova at Display Week 2025
New chip format enables ultra-small, high-efficiency microLED for wearables, automotive and consumer displays.
Aidentyx Unveils Chip Industry’s First Manufacturing AI Framework
The path to continuous improvement for semiconductor manufacturers got a lot easier today with the announcement by Aidentyx, Inc. that it has rolled out the chip industry’s first Manufacturing AI framework featuring multiple applications, each backed by specialized AI engineering agents orchestrating smart, secure, and net-zero-friendly AI analytics that promote greater interoperability, collaboration, and increased performance among applications and data sources.
Arteris Joins Intel Foundry Accelerator Ecosystem Alliance Program to Support Advanced Semiconductor Designs
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today announced that it has joined Intel Foundry Accelerator Ecosystem Alliance Program, as a member of both the IP Alliance and the recently announced Chiplet Alliance.
SEMI 3D & Systems Summit to Spotlight Trends in Hybrid Bonding, Chiplet Architecture and Geopolitical Dynamics
Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, June 25-27, 2025, in Dresden.
What’s in the April/May Issue?
Each issue of Semiconductor Digest has articles found only in the magazine. Click on the links to read the articles in the April/May issue.
Siemens and Intel Foundry Advance Collaboration
Siemens Digital Industries Software today announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement.
Worldwide Silicon Wafer Shipments Increase 2% Year-on-Year in Q1 2025, SEMI Reports
Worldwide silicon wafer shipments increased 2.2% year-on-year (YoY) to 2,896 million square inches (MSI) from the 2,834 MSI recorded during the same quarter of 2024.
Synopsys and Intel Foundry Propel Angstrom-Scale Chip Designs on Intel 18A and Intel 18A-P Technologies
At today’s Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry’s first commercial foundry implementation of PowerVia backside power delivery.
VSORA Raises $46 Million to Bring World’s Most Powerful AI Inference Chip to Market
VSORA, a French innovator and the only European provider of ultra-high-performance artificial intelligence (AI) inference chips, today announced that it has successfully raised $46 million in a new fundraising round.
Northeast Microelectronics Coalition Hub Launches $10 Million SCALE Capital Program to Advance Microelectronics Industry
The Northeast Microelectronics Coalition (NEMC) Hub, a division of the Massachusetts Technology Collaborative (MassTech) launched the SCALE Capital program, a $10 million grant initiative to advance microelectronics capability, training and product development across Massachusetts.
Veeco’s WaferStorm and WaferEtch Wet Processing Platforms Qualified for Advanced Packaging Applications
Veeco Instruments Inc. today announced a global Semiconductor IDM qualified Veeco’s WaferStorm and WaferEtch platform for two new applications in Advanced Packaging.
HKUST Research Sheds Light on Future Applications in Spintronics and Valleytronics
A team led by Prof. LIU Junwei from the Department of Physics at the Hong Kong University of Science and Technology (HKUST), along with their experimental collaborators, published their latest research findings in Nature Physics, which unveiled the first experimental observation of a two-dimensional layered room-temperature altermagnet, validating the theoretical predictions in Nature Communications made by Prof. Liu in 2021.
DNA-Inspired Design for Stronger, Flexible Sensors for Wearables
The double-helical design places both electrodes at one end, preventing damage that typically occurs when electrodes are pulled at joints.
Seoul Semiconductor: Unified Patent Court Orders Recall of Products Infringing Essential Micro LED Patents
Seoul Semiconductor Co., Ltd., a global innovator of LED products and technology, announced that the Local Division Paris of the Unified Patent Court (UPC), which has jurisdiction across 18 European countries, has issued a judgment that Laser Components SAS infringed Seoul Semiconductor affiliate’s core optical semiconductor patent.
Researchers Develop a Novel Annealing Processing System
In a groundbreaking study, a research team from Japan, led by Professor Takayuki Kawahara from the Department of Electrical Engineering at Tokyo University of Science, Japan, developed an innovative dual scalable annealing processing system (DSAPS) that can simultaneously scale both capacity and precision using the same scalable structure.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue, SEMI Reports
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported today in its Materials Market Data Subscription (MMDS).
Advanced Semiconductor Packaging Market Forecast to Grow at 7.5% CAGR Through 2031
The Advanced Semiconductor Packaging Market was valued at USD 18090 Million in the year 2024 and is projected to reach a revised size of USD 29800 Million by 2031, growing at a CAGR of 7.5% during the forecast period.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
OKI Circuit Technology has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ASIC and SoC Design Partner Rebrands as Aion Silicon
Aion Silicon (formerly Sondrel), a premier ASIC/SoC architecture and design partner, today officially unveiled its new name, vision, and leadership team.
ROHM Develops New High Power Density SiC Power Modules
ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for PFC and LLC converters in onboard chargers (OBC) for xEVs (electric vehicles).
Aion Silicon Joins Intel Foundry Accelerator Design Services Alliance
Aion Silicon (formerly Sondrel) today announced it has joined the Intel Foundry Accelerator Design Services Alliance.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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