MAGAZINE
April/May
centrotherm clean solutions Becomes Pfeiffer Vacuum+Fab Solutions
The Busch Group, one of the largest vacuum solution providers worldwide, announces that its brand centrotherm clean solutions will become part of Pfeiffer Vacuum+Fab Solutions.
POET Appoints Ghazi Chaoui, PhD, as Senior Vice President – Global Manufacturing and Digital Transformation
POET Technologies Inc. today announced the appointment of Ghazi M. Chaoui, PhD, MBA as its Senior Vice President of Global Manufacturing and Digital Transformation.
Atomically Thin Memory Resistors Will Optimize Semiconductors for Neuromorphic Computing
A joint project between University of Kansas and University of Houston supported by $1.8 million from the National Science Foundation’s second Future of Semiconductor program (FuSe2) will produce atomically tunable memory resistors.
Biden-Harris Administration Announces Preliminary Terms with Corning and Powerex to Support U.S. Supply Chain Resiliency
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce signed two separate preliminary memoranda of terms (PMT) under the CHIPS and Science Act to provide Corning up to $32 million in proposed direct funding and Powerex up to $3 million in proposed direct funding.
Siemens Launches Innexis Product Suite
Siemens Digital Industries Software announced today the Innexis product suite, a complement to its Veloce hardware-assisted verification and validation system.
Dr. Ann B. Kelleher Named Dr. Lisa Su Woman of Innovation Award Recipient at WISH Conference
The Global Semiconductor Alliance (GSA) Women’s Leadership Initiative (WLI) announced the recipient of the 2024 Dr. Lisa Su Woman of Innovation Award: Dr. Ann B. Kelleher from Intel Corporation.
ROHM’s New 1200V IGBTs Achieve Industry-Leading Low Loss Characteristics with High Short-Circuit Tolerance
ROHM Semiconductor today announced new automotive-grade AEC-Q101 qualified 4th Generation 1200V IGBTs that combine class-leading low loss characteristics with high short-circuit resistance.
NVIDIA Names Ellen Ochoa to Board of Directors
NVIDIA today announced that it has named to its board of directors Ellen Ochoa, who was the former director of NASA’s Johnson Space Center in Houston, and the first Latina astronaut in space.
FormFactor and Advantest Partner on Silicon Photonics Wafer-Level Test Cell to Enable High-Volume Manufacturing
FormFactor, Inc. and Advantest Corporation announced today a strategic partnership to develop a novel test cell and measurement system designed for high-volume production of silicon photonics (SiPh) and co-packaged optics (CPO) devices.
Fabrication of 4-inch Wafer-Scale Heterostructure via PECVD
KIMM achieves world’s first large-area semiconductor fabrication with TMDc and graphene heterostructure.
New PFAS Removal Process Aims to Stamp Out Pollution Ahead of Semiconductor Industry Growth
A University of Illinois Urbana-Champaign study is the first to describe an electrochemical strategy to capture, concentrate and destroy mixtures of diverse chemicals known as PFAS — including the increasingly prevalent ultra-short-chain PFAS — from water in a single process.
Heidelberg Instruments Reports Major Orders for the VPG+ 1400 FPD Volume Pattern Generator
Heidelberg Instruments has secured two major orders for its VPG+ 1400 FPD Volume Pattern Generator from leading photomask manufacturers in Asia, with a total order value between EUR 9 million and EUR 10 million.
Boston Materials Announces $13.5M in New Funding for Manufacturing Expansion and Establishing Supply Chain Partnerships
BOSTON MATERIALS, INC., a manufacturer of advanced materials key to the next generation of semiconductors and aircraft platforms, today announced $13.5 million in new funding.
ACM Research Announces Major Performance Breakthrough for Ultra C Tahoe Cleaning Tool for Front-End Semiconductor Manufacturing
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool.
MACOM Expands IC Design Expertise with Acquisition of ENGIN-IC
MACOM Technology Solutions Holdings announced today that it has acquired ENGIN-IC, Inc., a fabless semiconductor company that designs advanced Gallium Nitride monolithic microwave integrated circuits and integrated microwave assemblies located in Plano, Texas and San Diego, California.
Compound Semiconductor Materials Market Size to Surpass USD 60.75 Billion by 2033
Compound semiconductors are formed when two or more elements from separate or the same group on the periodic table are brought together and combined. Due to the increased demand for applications on electronic and mobile devices, it has experienced phenomenal growth over the past few years.
Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024
Empower Semiconductor will demonstrate its new Crescendo platform with FinFast technology at electronica 2024, the world’s leading trade fair and conference for electronics.
Alchip Announces Successful 2nm Test Chip Tapeout
Joins the first wave of new semiconductor transistor architecture development.
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.
MACOM Selected to Lead Advanced GaN-on-SiC Semiconductor Technology Development Project
MACOM Technology Solutions Inc. today announced that it has been selected to lead a development project to establish advanced gallium nitride (“GaN”) on silicon carbide (SiC) process technologies for radio frequency (“RF”) and microwave applications.
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.
Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge
Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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