MAGAZINE
April/May
Entegris Announces CEO Succession Plan
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced that Bertrand Loy will retire as President and Chief Executive Officer after 13 years in those roles, effective August 18, 2025.
Aledia to Showcase FlexiNova at Display Week 2025
New chip format enables ultra-small, high-efficiency microLED for wearables, automotive and consumer displays.
EDA and IP Industries Face Dickensian Quandary – Will Value Win Over Complacency?
Fundamental changes are changing the value of EDA and IP, but not for the better. Will AI be the game changer?
ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels.
Entegris Appoints Mary Puma to Board of Directors
Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and other high-technology industries, today announced the appointment of Mary Puma to its board of directors.
Starting a Fluorescent Biosensor Revolution
Molecular biosensors that only light up upon binding their targets open vast possibilities for medical diagnostics, fundamental research, environmental monitoring, and more.
ROHM and UAES Sign a Long-Term Supply Agreement for SiC Power Devices
ROHM Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, today announced they have entered into a long-term supply agreement for SiC power devices.
Micron Introduces HBM3E 12-high 36GB
Micron’s HBM3E 12-high 36GB delivers significantly lower power consumption than other 8-high 24GB offerings, despite having 50% more DRAM capacity in the package.
DELO Introduces New Microelectronics Adhesive for Ultra-Fine Structures
DELO has developed a new adhesive that can be used to create ultra-fine structures within seconds.
Applied Materials Appoints Florent Ducrot as Head of European Operations
Applied Materials, Inc. today announced Florent Ducrot, Vice President and General Manager, to serve as the Head of European Operations.
ACM Research Receives Orders for Wafer-Level Packaging Tools from U.S. Customer and R&D Center
ACM Research, Inc. today announced it has received purchase orders for four wafer-level packaging tools, including two from a U.S.-based customer and two from a U.S.-based research and development (R&D) center.
Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period.
Applied Ventures and ITIC Taiwan Joins Series B Funding For Wise-integration’s ‘Disruptive’ Technology
Wise-integration today announced that the investment fund, Applied Ventures-ITIC Innovation Fund (AVITIC), joined the company’s Series B funding round.
How Semiconductor Technologies are Enabling the Next Wave of Augmented Reality
The rapid advancement of Augmented Reality (AR) technology is pushing the boundaries of how we interact with digital information and the physical world
A New Advancement in Photonic Chips Set to Unlock an Industry
Researchers from TMOS, the ARC Centre of Excellence for Transformative Meta-Optical Systems, have developed a new engineering approach to on-chip light sources that could lead to widespread adoption of photonic chips in consumer electronics.
VIS and NXP Announce Establishment of VSMC Joint Venture
Vanguard International Semiconductor Corporation and NXP Semiconductors N.V. today announced that they have obtained all necessary approvals from relevant authorities and injected capital to officially establish the VisionPower Semiconductor Manufacturing Company Pte Ltd (VSMC) joint venture.
SEMICON India 2024 to Highlight Local Semiconductor Ecosystem Growth and Industry Trends from September 11-13
SEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR.
Onto Innovation Announces Opening of Packaging Applications Center of Excellence
Customers and collaborators will have early access to next-generation glass substrate tools and software solutions to accelerate panel-level packaging R&D.
AMD Appoints AI Industry Veteran Keith Strier to Expand Global AI Capabilities and Engagements
AMD today announced that Keith Strier has joined the company as senior vice president of global AI markets.
AGC Establishes a New Technical Service Site in Taiwan
This center will provide technical services for chemical products focused on semiconductor and electronic materials.
Lam Research Appoints Ita Brennan and Mark Fields to Board of Directors
Lam Research Corp. today announced that Ita Brennan and Mark Fields have joined its board of directors, effective August 30, 2024.
SEMI Energy Collaborative Releases Recommendations for Growing the Supply of Low Carbon Energy in Japan
Seeking to bolster global semiconductor value chain efforts to lower greenhouse gas (GHG) emissions, the industry association SEMI released today an analysis by its Energy Collaborative (EC) of current and forecasted low-carbon energy (LCE) markets for Japan, the second in a series of market-specific reports.
IEDC to Target Semiconductor Innovation and Launch New Taiwan Office
Indiana will showcase its bold, future-focused strategy at SEMICON Taiwan and announce a new office in Taipei to further develop relationships and two-way trade opportunities.
Featured Video
Huber USA is focused on providing high precision thermoregulation solutions in research and industry, offering temperature control solutions for applications from -125°C to +425°C. At SEMICON West 2024, Editor-in-Chief Pete Singer talked to Huber semiconductor specialist Nate George about the company’s dynamic temperature control systems, including new Unistat 815 and TC100c CS chillers, classic heating and cooling circulators, its push into natural refrigerants, applications in deposition and etch, and its 4-year warranty, 24/7 service program.
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Building Fabs in the U.S. vs Taiwan: Twice as Long, Twice as Much
Construction costs in the U.S., compared to Taiwan, are about twice as much (the process equipment costs are similar). “Building a wafer fab in the west costs twice as much and takes twice the time of building it in Taiwan,” Exyte’s Blaschitz said at SEMI’s ISS.
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