The Summit will showcase the continued rapid expansion of the RISC-V ecosystem, with both commercial offerings and exciting open-source developments.
Packaging
Global Embedded Die Packaging Technology Market to Generate $311.41 Million by 2030
Increase in requirement for miniaturization of electronic circuits in microelectronic devices drives the growth of the global embedded die packaging technology market.
CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
ClassOne Technology and Fraunhofer ENAS to Collaborate on Hybrid Bonding for Advanced Imaging Devices
Partnership will leverage firms’ respective heterogeneous-integration proficiencies to focus on development and optimization of full process-integration schemes for diverse high-density pixel array applications.
Global Semiconductor Equipment Billings Grow 5% Year-Over-Year in Q1 2022, SEMI Reports
Global semiconductor equipment billings grew 5% year-over-year to US$24.7 billion in the first quarter of 2022, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
Kioxia to Complete Acquisition of Chubu Toshiba Engineering
Kioxia Holdings Corporation announced today that it completed the acquisition of Chubu Toshiba Engineering Corporation.
A Consortium of Chipmakers Prepared to Buy Arm Outright Would Be a Semiconductor Gamechanger, Says GlobalData
Qualcomm would be prepared to invest in Arm alongside rival semiconductor companies or could join forces with other chipmakers to buy Arm outright.
SEMI Europe Urges Swift Adoption of European Chips Act
SEMI Europe, the industry association that unites the entire electronics manufacturing and design supply chain in Europe, urged swift adoption of the European Chips Act and invited discussions on the legislation with the European Parliament, Member States and the European Commission.
Purdue Launches Nation’s First Comprehensive Semiconductor Degrees Program
In the next five years, a minimum of 50,000 trained semiconductor engineers will be needed in the United States to meet the overwhelming and rapidly growing demand.
Intel Selects Diverse Ohio-Based Team to Lead Early Excavation Work for Ohio Fabs
McDaniel’s Construction Corp., Northstar Contracting Inc. and GTSA Construction Consulting, in partnership with Gilbane Building Company, represent first of projected 7,000 construction jobs.
