Packaging

JCET Expands Production Capacity in Suqian

JCET Group, a global integrated-circuit manufacturing and technology service provider, announced the official opening of the second phase of its IC packaging and testing facility in Suqian.

Chroma Releases the Newest Semiconductor Test Solution

Chroma ATE Inc., a supplier of precision Test and Measurement Instrumentation, Automated Test Systems, Intelligent Manufacturing Systems, Turnkey Test and Automation Solutions has recently released the newest semiconductor test solution for the IoT IC market.

Power Module Packaging Market Will Grow to Around US$3.5B by 2026

In 2020, motor drives represented the most significant power module market with a value of US$1.6 billion.

CEA-Leti Unveils Breakthrough for Mass-Market, High-Performance, Navigation-Grade Gyroscopes

CEA-Leti scientists, in collaboration with researchers at Politecnico di Milano have developed the world’s smallest-footprint MEMS gyroscope that is capable of providing navigation-grade performance.

Power Semiconductor Innovator GaN Systems Announces $150 Million in Growth Capital Funding

GaN Systems today announced a US $150 million growth capital funding round to accelerate innovation and adoption of GaN technology across its automotive, consumer, industrial, and enterprise markets.

Annual Revenue Growth to Skyrocket Among Top 25

Big gains in artificial intelligence, machine learning, 5G infrastructure provide strong boost to sales growth at AMD, MediaTek, Nvidia, and Qualcomm this year; declines for Intel and Sony.

Watlow’s Facility in Winona, MN Selected as Business of the Year

Watlow, a designer and manufacturer of complete thermal systems, announced that its facility in Winona, MN was selected by the Winona Chamber of Commerce as ‘Business of the Year.’

Watlow New STREAMLINE Heating System with ATS Technologies Reduces the Complexity Associated with Legacy Systems on a Semiconductor Tool

Watlow, a designer and manufacturer of complete thermal systems, announced the launch of its new STREAMLINE Heating System featuring Adaptive Thermal Systems (ATS) technologies.

Lam Research Appoints Jyoti Mehra to Board of Directors

Lam Research Corporation today announced Jyoti Mehra has joined its board of directors, effective November 9th.

2021 Silicon Parts Demand Outstrips Supply as Market Grows >30%

TECHCET announced silicon parts demand is outpacing supply given pandemic-induced needs for increased safety stocks and high chip production.

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