MAGAZINE
March
Revolutionizing Memory Technology: Multiferroic Nanodots for Low-Power Magnetic Storage
In a significant milestone for multiferroic memory devices, a team of researchers led by Professor Masaki Azuma and Assistant Professor Kei Shigematsu from Tokyo Institute of Technology in Japan has successfully developed nanodots with single ferroelectric and ferromagnetic domains.
IBM, Government of Canada, Government of Quebec Sign Agreements to Strengthen Canada’s Semiconductor Industry
The agreements reflect a combined investment valued at approximately $187M CAD.
JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard
JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of the next version of its High Bandwidth Memory (HBM) DRAM standard.
NucleiSys Adopts Breker’s System Coherency TrekApp
Breker Verification Systems announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.
SmartDV and NSITEXE Sign Agreement
SmartDV Technologies, a supplier of Design and Verification Intellectual Property (IP), and NSITEXE, developer of advanced processors, today signed a multi-year agreement that enables SmartDV to license NSITEXE’s recently announced RISC-V-based, 32-bit CPU core to its customers.
America COMPETES Act of 2022 Is a Much-Needed Bill, but Not Sufficient to Compete with China, Says ITIF
Following the introduction of the America COMPETES Act of 2022 from the House of Representatives, companion legislation to the U.S. Innovation and Competition Act (USICA), which passed the Senate last June, the Information Technology and Innovation Foundation (ITIF), the leading think tank for science and technology policy, released the following statement.
CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
CEVA, Inc. announced today that it has expanded its IP market reach by introducing the Fortrix SecureD2D IP solution.
Wooptix Introduces a Patterned Wafer Geometry System for 300mm Silicon Wafers
Wooptix SL will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials.
North American Semiconductor Equipment Industry Posts December 2021 Billings
After record-breaking billings of North America-based semiconductor equipment manufacturers in November 2021, December billings remained robust and were the second-highest ever.
Asymmetry is Key to Creating More Stable Blue Perovskite LEDs
For the first time, researchers have created blue LEDs using layers of metal halide perovskite linked with asymmetrical bridges, solving a critical instability problem.
SPIE and the University of Rochester Announce $1 Million Optics Graduate Fellowship
SPIE, the international society for optics and photonics, and the University of Rochester have announced the establishment of the SPIE Graduate Fellowship in Optical Sciences and Engineering.
Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System for Next Generation High Bandwidth Memory Applications
Veeco Instruments Inc. today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).
SEMI Industry Strategy Symposium Europe to Spotlight Environmental Sustainability, Social Responsibility and Supply Chain Resilience
SEMI announced today the return of the Industry Strategy Symposium Europe (ISS Europe) 2022 as an in-person event to Brussels, Belgium, May 30, with insights from leading analysts, economists, policymakers and technologists on major forces impacting the semiconductor industry.
Kandou Expands into Silicon Glen
Kandou, a developer in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, officially opened its Silicon Glen office in East Kilbride, Scotland, today.
Weebit Nano Demonstrates Its First Crossbar ReRAM Arrays
Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, announced that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips.
EV Group Recognized by Bosch as a Preferred Supplier of Semiconductor Equipment
EVG is the first semiconductor equipment supplier ever to receive Preferred Supplier status.
Addressing the Microchip Shortage
This country’s semiconductor chip shortage is likely to continue well into 2022, and a Georgia Tech expert predicts that the U.S. will need to make major changes to the manufacturing and supply chain of these all-important chips in the coming year to stave off further effects.
Harnessing Noise in Optical Computing for AI
A research team led by the University of Washington has developed new optical computing hardware for AI and machine learning that is faster and much more energy efficient than conventional electronics.
IC Sales Seen Growing by Double-Digits for Third Year in a Row
First three-year period of double-digit gains in 25 years, based on IC Insights’ forecast.
Trio-Tech Resumes Operations at Tianjin City Facility
Trio-Tech International today announced that it has resumed full operations at the Company’s Tianjin, China, facility.
Amcor Announces Strategic Investment in PragmatIC Semiconductor
In its continuing efforts to discover and develop innovative technologies for the packaging industry, Amcor announced today its strategic investment in PragmatIC Semiconductor.
Intel Announces Next US Site with Landmark Investment in Ohio
Intel will invest more than $20 billion to build two new factories and to establish a new epicenter for advanced chipmaking in the Midwest.
NUS Research Team Sets New Efficiency Record for Solar Cell Technology
Their solar cells made using perovskite and organic materials achieve a power conversion efficiency of 23.6%, approaching that of conventional silicon solar cells.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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