Automotive IC sales expected to post average annual growth of 13.4%; Communications and Computer segments remain largest applications.
Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.
onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).
Researchers experimentally demonstrate the first fully connected annealing processor that can be scaled up across multiple chips.
ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.
EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions.
Results of 11th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.
Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.
Enabling real-time analytics for silicon health monitoring of increasingly large, complex designs, Synopsys, Inc. today announced an innovative streaming fabric technology that shortens both silicon data access and test time by up to 80% while also minimizing excessive power.
Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.
The Autonomous Vehicle Computing Consortium and SEMI announced today an alliance to drive autonomous vehicle innovation.
Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.
GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family.
Price volatility in chemicals used for semiconductors further strains market.
Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
SABIC has named Conventus Polymers, LLC, as an authorized distributor of high-performance engineering thermoplastics in the United States, Canada and Mexico.
Nordson Corporation announced that Anand Patel will succeed Ray Cushing as vice president, treasury and finance following Ray’s upcoming retirement.
CZI co-founders and co-CEOs Mark Zuckerberg and Priscilla Chan and President of Harvard University Lawrence Bacow commemorate new research institute to study natural and artificial intelligence.
Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.
Presenting world’s first upstream 100 Gbit/s PAM-4 linear burst-mode transimpedance amplifier (TIA) chip for the roll-out of next-generation flexible PONs.
The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has signed a cooperative research and development agreement with Google to develop and produce chips that researchers can use to develop new nanotechnology and semiconductor devices.
An open, secure monitoring and intelligence transaction platform would empower chip manufacturers to solve their problems and optimize their operations, their way.
Choosing the right 4IR technology can eliminate risk in digital adoption.
SEMICON West 2022 —CyberOptics
At SEMICON West 2022, Editor-in-Chief Pete Singer caught up with Subodh Kulkarni, President and CEO, of CyberOptics who provides some insights into the the company’s next generation WaferSense® Auto Teaching System™ (ATS2) and new ReticleSense® Auto Teaching System™ (ATSR) that were introduced at the show. ATS2 and ATSR are multi camera sensors used with CyberSpectrum™ software to teach accurate wafer and reticle hand-off calibration for proper alignment and set-up of semiconductor tools. The sensors “see” inside to capture three dimensional off-set data (x, y and z) in real-time to quickly teach wafer and reticle transfer positions – all without opening the tools. Process and equipment engineers can conduct repeatable and reproducible setups and maintenance checks, speed trouble-shooting and eliminate technician-to-technician variation.
Semiconductor Daily Digest in your inbox