Automotive IC Marketshare Seen Rising to 10% by 2026

Automotive IC sales expected to post average annual growth of 13.4%; Communications and Computer segments remain largest applications.

StratEdge Packaging and Assembly Services Expands for High-Frequency and High-Power Devices

Technical experts available at BCICTS 2022 and IMAPS 2022 to discuss packaging applications.

onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers

onsemi today announced a trio of silicon carbide (SiC) based power modules in transfer molded technology that are intended for use in on-board charging and high voltage (HV) DCDC conversion within all types of electric vehicles (xEV).

Scalable and Fully Coupled Quantum-inspired Processor Solves Optimization Problems

Researchers experimentally demonstrate the first fully connected annealing processor that can be scaled up across multiple chips.

ACM Research Launches New Furnace Tool for Thermal Atomic Layer Deposition to Support Advanced Semiconductor Manufacturing Requirements

ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace tool.

Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA

EPFL and former Stanford professor recognized for his significant impact on the electronic system design industry through pioneering technical contributions.

eBeam Initiative Survey Reports EUV Fueling Photomask Industry Growth

Results of 11th annual Luminaries survey to be presented at live event held during SPIE Photomask Technology + EUV Lithography Conference.

Nearly $11M in Addtional DOD Funds Expands Purdue-led Microelectronics Workforce Program

Five-year extension of SCALE workforce initiative aims to restore global lead through education initiatives.

Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time

Enabling real-time analytics for silicon health monitoring of increasingly large, complex designs, Synopsys, Inc. today announced an innovative streaming fabric technology that shortens both silicon data access and test time by up to 80% while also minimizing excessive power.

Global Fab Equipment Spending Forecast to Reach All-Time High of Nearly $100 Billion in 2022

Global fab equipment spending for front-end facilities is expected to increase approximately 9% year-over-year (YOY) to a new all-time high of US$99 billion in 2022.

SEMI and AVCC Team to Promote Autonomous Vehicle Innovation and Mass Market Adoption

The Autonomous Vehicle Computing Consortium and SEMI announced today an alliance to drive autonomous vehicle innovation.

New Nanocomposite Films Boost Heat Dissipation in Thin Electronics

Scientists from Japan developed cellulose nanofiber-carbon fiber composite films with high in-plane heat conductivity to assist in heat dissipation.

GOWIN Semiconductor New 22nm High-Performance FPGA Family

GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family.

Electronic Wet Chemicals Price Volatility Sparks Concern

Price volatility in chemicals used for semiconductors further strains market.

Siemens Automates 2.5D and 3D IC Design-for-Test with New Tessent Multi-Die Solution

Siemens Digital Industries Software today introduced the Tessent Multi-die software solution, which helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.

SABIC Names Conventus Polymers as New Distribution Partner for Specialty Thermoplastics in North America

SABIC has named Conventus Polymers, LLC, as an authorized distributor of high-performance engineering thermoplastics in the United States, Canada and Mexico.

Nordson Corporation Appoints Anand Patel as Vice President, Treasury and Finance

Nordson Corporation announced that Anand Patel will succeed Ray Cushing as vice president, treasury and finance following Ray’s upcoming retirement.

Science, Tech, and AI Leaders Convene to Launch Kempner Institute

CZI co-founders and co-CEOs Mark Zuckerberg and Priscilla Chan and President of Harvard University Lawrence Bacow commemorate new research institute to study natural and artificial intelligence.

Defense Strategies Institute Announces 2022 Assured Microelectronics Summit Agenda

Defense Strategies Institute is pleased to announce the agenda for the 2022 Assured Microelectronics Summit is now available.

Imec Researchers Work to Debut Key Building Block for the Deployment of 100G PON Networks

Presenting world’s first upstream 100 Gbit/s PAM-4 linear burst-mode transimpedance amplifier (TIA) chip for the roll-out of next-generation flexible PONs.

NIST and Google to Create New Supply of Chips for Researchers and Tech Startups

The U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) has signed a cooperative research and development agreement with Google to develop and produce chips that researchers can use to develop new nanotechnology and semiconductor devices. 

A New Framework: Opportunities of Open Access for Optimizing Yield in Semiconductor Manufacturing

An open, secure monitoring and intelligence transaction platform would empower chip manufacturers to solve their problems and optimize their operations, their way.

Overcoming the Risks of Change Management When Adopting Digital Technology

Choosing the right 4IR technology can eliminate risk in digital adoption.

SEMICON West 2022 —CyberOptics

At SEMICON West 2022, Editor-in-Chief Pete Singer caught up with Subodh Kulkarni, President and CEO, of CyberOptics who provides some insights into the the company’s next generation WaferSense® Auto Teaching System™ (ATS2) and new ReticleSense® Auto Teaching System™ (ATSR) that were introduced at the show. ATS2 and ATSR are multi camera sensors used with CyberSpectrum™ software to teach accurate wafer and reticle hand-off calibration for proper alignment and set-up of semiconductor tools. The sensors “see” inside to capture three dimensional off-set data (x, y and z) in real-time to quickly teach wafer and reticle transfer positions – all without opening the tools. Process and equipment engineers can conduct repeatable and reproducible setups and maintenance checks, speed trouble-shooting and eliminate technician-to-technician variation.

Featured Products



202225sepAll Day29octSPIE Photomask Technology + Extreme Ultraviolet LithographyMonterey Conference Center, 1 Portola PlazaFeatured

202228sep(sep 28)1:00 am30(sep 30)1:00 amUltrapure Micro 2022Glendale Civic Center, 5750 W Glenn Drive


202225sepAll Day29octSPIE Photomask Technology + Extreme Ultraviolet LithographyMonterey Conference Center, 1 Portola PlazaFeatured

202203octAll Day05Strategic Materials Conference — SMC 2022DoubleTree by Hilton San Jose, 2050 Gateway PlaceFeatured

202203octAll Day06IMAPS 2022 — 55th International Symposium of MicroelectronicsHynes Convention Center, 900 Boylston Street

202203oct7:00 am7:00 pmIMAPS Advanced Technology WorkshopSTRATEGIES TO REVITALIZE THE ON-SHORE PACKAGING AND ASSEMBLY DEFENSE INDUSTRIAL BASEHynes Convention Center, 900 Boylston Street

202210octAll Day12MEMS & Sensors Executive Congress — MSEC 2022Coronado Island Marriott Resort & Spa, 2000 2nd StFeatured

202219octAll DayElectronic Specialty Gas ConferenceWild Horse Pass


202230octAll Day02novInternational Trade Partners Conference — ITPC 2022Fairmont Orchid - Hawai'i, 1 N Kaniku DrFeatured

202202novAll Day03Assured Microelectronics SummitPresented by the Defense Strategies InstituteAmerican Institute of Architects HQ, 1735 New York Ave NW, Washington, D.C.Featured

202215novAll Day18SEMICON Europa 2022Messe Munchen, MessegeländeFeatured