MAGAZINE
March
Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SEMI Applauds U.S. CHIPS Act Award for Micron Technology
“SEMI commends the U.S. Department of Commerce for this key step to strengthen the domestic semiconductor supply chain,” said Joe Stockunas, President of SEMI Americas.
Colliers Joins Silicon Catalyst Ecosystem as an In-Kind Partner
The Silicon Valley office of Colliers announced today that it has joined Silicon Catalyst, the world’s only incubator focused on accelerating semiconductor solutions, as an In-Kind Partner.
Micron to Bring EUV Technology to Japan, Advancing Next-Generation Memory Manufacturing
Micron Technology, Inc. announced today it will be introducing extreme ultraviolet (EUV) technology to Japan, tapping this sophisticated patterning technology to manufacture its next generation of DRAM, the 1-gamma (1γ) node.
Lattice Wins 2023 SEAL Sustainability Innovation Award
Lattice Semiconductor today announced that it was named a 2023 SEAL Sustainability Innovation Award winner.
Imec Ranked Number One Start-up Accelerator by UBI Global
Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announced that it was placed first by UBI Global in its biennial ranking in the category World Top Business Accelerator – Linked to University.
Micron Scales Storage to New Heights With Launch of Two Data Center Drives
Micron Technology, Inc., (Nasdaq: MU), today announced the release of two SSDs, the Micron 6500 ION NVMe SSD and the Micron XTR NVMe SSD.
MICLEDI Microdisplays Demonstrates Brightest Green, Blue, and Red microLED Arrays at Display Week
Next week at Display Week 2023, MICLEDI Microdisplays, a technology company in the field of microLED (µLED) displays for high def, ultra-compact displays, will be on hand to demonstrate its portfolio of R, G and B µLEDs.
SMC Korea 2023 Opens Tomorrow With Future of Semiconductor Materials, Sustainability in Focus
Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC (Strategic Materials Conference) Korea 2023 tomorrow at the Suwon Convention Center in Suwon-si, Gyeonggi-do, South Korea.
Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter.
Final Call: Applications for the 2nd Tech Innovation Excellence Award (TIE Award)
The deadline for applications for the 2nd Tech Innovation Excellence Award (TIE Award) is approaching.
NXP and TSMC to Deliver Industry’s First Automotive 16nm FinFET Embedded MRAM
NXP Semiconductors today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM in 16nm FinFET technology.
GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program
In response to mounting concerns about climate change, tech companies around the world are accelerating the efforts to complete carbon neutrality for their supply chains and products.
Enablence Technologies Ramps Capacity at Fremont Fab
Enablence Technologies Inc. and Noel Technologies announced today a strategic partnership designed to substantially ramp production of Enablence’s planar lightwave products at its Fremont, California wafer fab.
Intel Surpasses First 2030 Goal: $2 Billion in Diverse Supplier Spending
Early success boosts Intel’s commitment to strengthening supplier diversity in the semiconductor ecosystem.
Littelfuse Appoints Dr. Greg Henderson to Board of Directors
Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.
Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations
Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).
Purdue and India Establish Milestone Semiconductor Alliance
Purdue University continues to rapidly expand its global boundaries in semiconductors, announcing a transformative agreement to become the flagship academic partner and collaborator with the government of India.
Electronics Industry Welcomes Reintroduction of Bipartisan Proposal to Boost U.S. Printed Circuit Board Sector
The electronics manufacturing industry is welcoming the reintroduction of bipartisan legislation in the U.S. Congress that would help rebuild the country’s printed circuit board (PCB) sector.
Cadence Appoints Mary Louise Krakauer as Chair of the Board
Cadence Design Systems, Inc. today announced that current Cadence board member, Mary Louise (ML) Krakauer, has assumed the role of chair of the board, effective May 4, 2023.
Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0
Samsung Electronics Co. Ltd. today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.
Featured Video
Is your semiconductor plant seeking methods to enhance sustainability in wafer manufacturing and water reclamation? The semiconductor sector faces two challenges: waste reduction and water usage. The use of on-line water analytics can assist in overseeing water quality in both wafer manufacturing and reclamation/reuse procedures. This video underscores the significance of monitoring the levels of conductivity, TOC, and microbes to identify impurities that may lead to rejected wafers. Monitoring these parameters also ensures the purity of water to improve wafer quality and yield. Furthermore, this video emphasizes the importance of monitoring the levels of dissolved oxygen, TOC, and pH in waste streams to optimize water recovery.
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U.S. Aims for 20% of World’s Leading Edge Semiconductor Production by 2030
Secretary of Commerce Gina Raimondo believes investments in leading-edge logic chips manufacturing will put the U.S. on track to produce roughly 20 percent of the world’s leading-edge logic chips by the end of the decade.
Water Supply Challenges for the Semiconductor Industry
The energy-hungry nature and large carbon footprint of semiconductor manufacturing have received considerable attention in the context of reducing our emissions of planet-warming greenhouse gases. It turns out we are just as thirsty as we are hungry.
Professors from MIT, UCLA to be Honored for Excellence in Semiconductor Research
The Semiconductor Industry Association (SIA), in collaboration with the Semiconductor Research Corporation (SRC), today announced the winners of its 2019 University Research Awards.
What Do Small Companies Need to Know about the CHIPS Act?
IBM’s Poughkeepsie, N.Y. site was the backdrop for one of President Biden’s speeches promoting the passage of the $52B CHIPS (Creating Helpful Incentives to Produce Semiconductors) and Science Act, a rare piece of legislation for which the president won bipartisan support.
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
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